Name Affiliation دانشجوی دانشگاه بوعلی سینا Degree _ Website Email — JournalPaper Presentation Speech WorkShop Book Innovation GrantAttraction Thesis Festival FinishedProject Sales Art Membership StandardCreation Publication TheorizingChair TitleJournal 1 Effect of Grain Refinement on the Electrochemical Behavior of Pure Copper by Employing Mott–Schottky Analysis in Conjunction with Point Defect Model Analytical & Bioanalytical Electrochemistry 2 The Passive Film Characteristics of Cold Deformed Pure Copper JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE 3 Electrochemical Behavior of Nano-grained Pure Copper in Dilute Alkaline Solution with Chloride Ion Trace JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE 4 Enhancing the Electrochemical Behavior of Pure Copper by Cyclic Potentiodynamic Passivation: A Comparison between Coarse- and Nano-Grained Pure Copper METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE 5 Passivation Behavior of Ultrafine-Grained Pure Copper Fabricated by Accumulative Roll Bonding (ARB) Process METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE