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Title
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Microstructural characterization and electrochemical behavior of nano/ ultrafine grained pure copper through constrained groove pressing (CGP)
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Type
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JournalPaper
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Keywords
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Electrochemical characteristic MotteSchottky (MeS) analysis Passive film Electrochemical impedance spectroscopy (EIS) Constrained groove pressing (CGP)
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Abstract
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This study presents microstructural, electrochemical, and mechanical characterizations on pure copper fabricated using constrained groove pressing (CGP) in quiescent phosphate buffer solution (pH ¼ 11.73). We tested the effect of surface modifications on electrochemical features using electrochemical impedance spectroscopy (EIS) and MotteSchottky analysis.
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Researchers
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Majid Naseri (Second Researcher), Arash Fattah-alhosseini (Not In First Six Researchers), (Fifth Researcher), Davood Gholami (Fourth Researcher), Omid Imantalab (Third Researcher), Ahmad Keyvani (First Researcher)
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