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Abstract
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Effect of nano-grained structure on the electrochemical behavior of pure copper has been studied in this work. For this purpose, nano-grained structure was produced by accumulative roll bonding (ARB) process. To evaluate the microstructure and grain size refining after 8 cycles of ARB process, atomic force microscopy (AFM) was used. AFM image showed that nano-grained structure with average size of below 100 nm appeared after 8 cycles of ARB. Electrochemical behavior of annealed and 8 cycles number of ARB process has been studied by potentiodynamic polarization, electrochemical impedance spectroscopy (EIS) and Mott-Schottky analysis in an alkaline solution. All electrochemical tests revealed that as a result of grain refinement, the electrochemical behavior of the nano-grained structure significantly improves compared to the annealed pure copper.
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