In the present study, the effect of cold deformation on the electrochemical and passive behaviors of pure copper in 0.01 M NaOH solution was investigated. The dislocation density in cold deformation was calculated using a recently developed JAVA-based software, materials analysis using diffraction, based on Rietvelds whole x-ray pattern fitting methodology. At the thickness reduction of 70%, the microhardness measured as 125.30 HV, which is 1.56 times than that in the annealed pure copper (80.25 HV). Potentiodynamic polarization plots and electrochemical impedance spectroscopy measurements showed that increasing the cold deformation offers better conditions for forming the passive films. In the Mott-Schottky analysis, no evidence for n-type behavior was obtained which indicates that the oxygen vacancies and the copper interstitials did not have any significant population density in the passive films. Also, this analysis revealed that with increasing cold deformation, the acceptor density of the passive films decreased.
